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TO-220F-5 Vertical RM 2.54mm TO-220F-3, Vertical, RM 4.58mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-3 Vertical RM 10.95mm SOT-93 TO-218-3, Vertical, RM 2.54mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-2 Vertical RM 1.7mm Pentawatt Multiwatt-5 TO-220-7, Vertical, RM 1.27mm, MultiwattF-15, staggered type-2 TO-220F-11, Vertical, RM 2.54mm, IIPAK, I2PAK, see http://pdf.datasheetcatalog.com/datasheet/irf/iris4011.pdf TO-262-5 Horizontal RM 5.08mm TO-126-3, Horizontal, RM 5.45mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-2 Horizontal RM 1.27mm Multiwatt-7 staggered type-2 TO-220-15, Vertical, RM 5.45mm, , see https://toshiba.semicon-storage.com/ap-en/design-support/package/detail.TO-3P(N).html TO-3P-3 Vertical RM 0.97mm Multiwatt-9 staggered type-2 TO-220F-4, Vertical, RM 1.27mm, staggered type-2 TO-220-11, Vertical, RM 5.45mm, , see https://toshiba.semicon-storage.com/ap-en/design-support/package/detail.TO-3P(N).html TO-3P-3 Vertical RM 5.45mm TO-3PB-3, Horizontal, RM 5.475mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-3 Vertical RM 1.27mm Multiwatt-7 staggered type-2 TO-220-5, Horizontal, RM 5.45mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-2 Horizontal RM 5.475mm SOT-93 TO-218-3, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 10.16mm 400mil LongPads 5-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 7x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 16-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf Power Integrations K Package PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Single (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72599/72599.pdf 16-Lead Plastic TSSOP (4.4mm); Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf TQFP, 100 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.7mm, height 5, Wuerth electronics 9774100951 (https://katalog.we-online.de/em/datasheet/9774100951.pdf), generated.

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