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Back100644 Fireball/Fireball_panel.kicad_dru working_height = height - v_margin - title_font; saw_out = [third_col, third_row, 0]; saw_out = [output_column, bottom_row, 0]; pwm_pot = [input_column - h_margin/2, bottom_row, 0]; fm_in = [first_col, first_row, 0]; c_tune = [width_mm/2 + h_margin, top_row, 0]; f_tune = [width_mm/2 - h_margin, top_row, 0]; left_rib_x = thickness * 2; right_rib_x = width_mm - right_rib_thickness; Panels/10_step_seq_38hp_v3.2.scad Normal file View File Hardware/PCB/precadsr_Gerbers/precadsr-Edge_Cuts.gbr Normal file Unescape Hardware/PCB/precadsr/ao_tht.pretty/CP_Radial_D6.3mm_P2.50mm.kicad_mod Normal file Unescape Hardware/PCB/precadsr/Kosmo_panel.pretty/Kosmo_Panel_Slotted_Mounting_Hole_NPTH.kicad_mod Normal file View File Find and replace last few thin traces, fix teardrops and gnd fill Find and replace last few thin traces, fix teardrops and gnd fill Find and replace last few thin traces, fix teardrops and gnd fill db7d02719b68f4d2f81a25d8b6527257f18cc3a1 Embiggen traces, add teardrops updated C5 footprint & tracing; schematic annotation 2cbdb94ba94f485ce4abcb1f14e2e5f15d016647 updates the potentiometer pads and thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad HTSSOP32: plastic thin shrink small outline 7,5mm long https://toshiba.semicon-storage.com/info/docget.jsp?did=53548&prodName=TLP2770 6-Lead Plastic Small Outline (SO) - Wide, 5.3 mm Body [TQFP] With Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Thin Quad Flatpack (MW) - 10x10x1.0 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf DFN, 8 Pin (https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BME680-DS001-00.pdf#page=44), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for a single 0.127 mm² wire, reinforced insulation, conductor diameter 1.4mm, outer diameter 3mm, size source Multi-Contact FLEXI-E 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection, for 4 times 0.75 mm² wires, basic insulation, conductor diameter 0.4mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator connector JST VH series connector, B2PS-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Molex Pico-EZmate series connector, BM17B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator Molex PicoBlade Connector System, 43045-0621 (alternative finishes: 43045-220x), 11 Pins (http://www.molex.com/pdm_docs/sd/559350210_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-106-02-xxx-DV-BE-A, 6 Pins.
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