Labels Milestones
Back3.417x3.151mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition Appendix A BGA 1760 1 FF1761 FFG1761 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf.
- 5.444320e+000 -1.646057e+000 9.983999e+000 vertex -5.970783e+000 3.719342e+000.
- -0.0617224 -0.0392378 0.997322 vertex 7.0133 -3.85937 19.9472 facet.
- MCV_1,5/6-G-3.5; number of pins.
- -0.471387 -0.875985 0.102199 facet.
- -0.767815 -0.63438 0.0895698 facet.