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Https://www.st.com/resource/en/datasheet/stm32g431c6.pdf ST WLCSP-49, off-center ball grid, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 18x10 Layout, 0.4mm Pitch.

• Body [SSOP] (see Microchip Packaging.
• 0.246468 vertex -5.40019 -4.13797 7.76535 vertex.
• Vertex -0.948559 7.30706 6.90985 facet.

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