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- 16x16x1 mm Body, 2.00 mm Footprint [TQFP] (see Microchip Packaging Specification 00000049BS.pdf DFN package size 11.6x8.5x10.4mm^3, https://www.recom-power.com/pdf/Innoline/R-78Sxx-0.1.pdf dc-dc recom buck sip-12 pitch 2.54mm size 23.3x6.2mm^2 drill 1.1mm pad 2.2mm Terminal Block WAGO 804-113 45Degree pitch 5mm size 40x7.6mm^2 drill 1.3mm pad 2.5mm terminal.

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