Labels Milestones
Back14x14mm package, pitch 0.5mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf WLCSP-143, 11x13 raster, 4.521x5.547mm package, pitch 0.8mm Altera BGA-68 M68 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 15.24 mm (600 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil Socket 24-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 24-lead surface-mounted (SMD) DIP package, row spacing 26.67 mm (1050 mils), SMDSocket, SmallPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 18-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 48-lead.
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