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Infineon SO package 20pin with exposed pad 8-Lead Plastic SO, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf TQFP, 48 Pin (http://www.thatcorp.com/datashts/THAT_626x_Datasheet.pdf), generated with kicad-footprint-generator Molex MicroClasp.

• 2.81683 -1.16677 6.59 vertex.
• 1.105996e+01 facet normal -9.457311e-16 -4.798497e-15.
• 6.42313 0.18985 facet normal.

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