Labels Milestones
BackModular Case/EuroRack_Case_24.png Executable file View File Schematics/Luthers_VCO_schematic.pdf Normal file View File Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel-drl_map.pdf Normal file Unescape 2x Sockets, all three pins need wires: - glide in (sleeve and normal both GND - Gate out (could normal to TP10, optional) - Casc out 2x Toggle Switches, 2pin: - reset Pots, 3-pin: Glide attenuator (B10k) (join two left pins from below) - Clock rate (B100k) (not sure yet which 2 pins LED, diameter 3.0mm z-position of LED center 2.0mm, 2 pins, pitch 10mm, size 115x9mm^2, drill diamater 1.3mm, pad diameter 1.4mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py PQFP, 160 Pin (https://www.nxp.com/docs/en/package-information/SOT435-1.pdf), generated with kicad-footprint-generator Molex Pico-Clasp series connector, LY20-26P-DLT1, 13 Circuits (https://www.molex.com/pdm_docs/sd/2005280130_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 6-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_8_05-08-1637.pdf Texas Instrument DRT-3 1x0.8mm Pitch 0.7mm http://www.ti.com/lit/ds/symlink/tpd2eusb30.pdf DRT-3 1x0.8mm Pitch 0.7mm http://www.ti.com/lit/ds/symlink/tpd2eusb30.pdf DRT-3 1x0.8mm Pitch 0.7mm http://www.ti.com/lit/ds/symlink/tpd2eusb30.pdf DRT-3 1x0.8mm Pitch 0.7mm Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition (http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf UCBGA-36, 6x6 raster, 2.553x2.579mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition Appendix A BGA 484 1 FG484 FGG484 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=264, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, YZR pad definition Appendix A BGA 676 1.
- Normal -9.614031e-001 -3.839567e-003 2.751171e-001 vertex 4.034687e+000 2.310470e+000 2.473857e+001.
- 0.682453 0.560081 0.469646 facet normal -4.705319e-001 8.082495e-001 3.540233e-001.
- UFBGA-100, 12x12 raster, 7x7mm package, pitch 0.4mm.
- 21.8414 facet normal -7.808599e-001.
- -0.0942435 0.0285886 0.995139 vertex 1.46714 7.3758 6.0001.