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Package, http://www.icbank.com/icbank_data/semi_package/ssot8_dim.pdf Power MOSFET package, 3x3mm (see https://www.fairchildsemi.com/datasheets/FD/FDMC8032L.pdf Fairchild-specific MicroPak-6 1.0x1.45mm Pitch 0.5mm SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole angled pin header SMD 2x26 2.00mm double row Through hole angled pin header SMD 1x30 1.00mm single row style1 pin1 left Surface mounted pin header SMD 2x01 1.00mm double row surface-mounted straight pin header, 2x05, 2.54mm pitch, 8.51mm socket length, single row Through hole angled pin header THT 1x05 2.00mm single row Through hole angled pin header SMD 1x37 2.54mm single row style1 pin1 left Surface mounted pin header SMD 1x31 2.54mm single row Surface mounted socket strip SMD 1x19 1.27mm single row Through.

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