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3.73x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761.

• [eTSSOP] (see Microchip Packaging.
• Electrolytic capacitor | | .
• Normal 0.286108 -0.952732 0.102199 facet normal -0.768559.

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