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ST WLCSP-36, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A BGA 484 1 FB484 FBG484 FBV484 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm.

• Normal 0.734384 0.392543 0.553705 facet normal.
• Decontamination Hardware/Panel/precadsr_panel.svg | 4 .../PCB/precadsr_Gerbers/precadsr-F_Cu.gbr .

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