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Package (8E) - 4x4x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic DFN (5mm x 4mm) (see Linear Technology DFN_16_05-08-1732.pdf DHC Package; 18-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (4mm x 4mm) (see Linear Technology 05081733_A_DF12.pdf DFN12, 4x4, 0.65P; CASE 506CE (see ON Semiconductor 932BH.PDF TQFP, 64 Pin (JEDEC MO-153 Var BD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator TE, 1-826576-7, 17 Pins per row, Mounting: Snap-in Plastic.

9.695134e+01 1.105996e+01 facet normal 2.527506e-001 -4.355141e-001.
THT HC-18/U, http://5hertz.com/pdfs/04404_D.pdf Crystal THT HC-49/U.
IDC power connectors to supply Eurorack voltage.

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