Labels Milestones
Back7x7 area grid, YZR pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole straight pin header, 1x16, 2.54mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole socket strip THT 1x38 1.27mm single row Through hole angled pin header SMD 1x08 2.00mm single row style1 pin1 left Surface mounted pin header THT 2x21 1.27mm double row Through hole straight pin header, 2x10, 1.27mm pitch, double rows Through hole pin header THT 1x02 1.00mm single row Through hole pin header THT 1x32 2.54mm single row style1 pin1 left Surface.
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