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SmallPads 10-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 24-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x11.72mm 4x-dip-switch SPST Omron_A6H-4101, Slide, row spacing 7.62 mm (300 mils DIL DIP PDIP 2.54mm 22.86mm 900mil 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils DIL DIP PDIP 5.08mm 7.62mm 300mil 1x-dip-switch SPST , Slide, row spacing 5.08mm, pin-spacing 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Vertical RM 1.7mm staggered type-1 TO-220-9 Horizontal RM 10.95mm SOT-93 TO-218-3, Horizontal, RM 5.08mm, see https://www.centralsemi.com/PDFS/CASE/TO-220-2PD.PDF TO-220-2 Vertical RM 10.9mm TO-247-3, Horizontal, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Vertical RM 2.54mm staggered type-2 TO-220F-15, Vertical, RM 2.54mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-4 Vertical RM 0.9mm staggered type-1 TO-220-15, Horizontal, RM 2.54mm, staggered type-1 TO-220-4, Horizontal, RM 2.54mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-4 Horizontal RM 5.08mm TO-220-2, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 5.08mm 7.62mm 300mil LongPads 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 16-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 14-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil Socket LongPads 40-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 16-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 16-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), SMDSocket, SmallPads 10-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads THT DIP DIL PDIP SMDIP 2.54mm 9.53mm 375mil 4-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 7x-dip-switch SPST KingTek_DSHP07TS, Slide, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of 8-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 10.8x21.88mm 8x-dip-switch SPST , Slide, row spacing 26.67 mm (1050 mils), SMDSocket, LongPads 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x11.72mm 4x-dip-switch SPST KingTek_DSHP04TJ, Slide, row spacing 7.62.

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