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BackSIP-12, pitch 2.54mm, size 13.16x6.5mm^2, drill diamater 1.3mm, pad diameter 2.1mm, see http://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F282834%7FC1%7Fpdf%7FEnglish%7FENG_CD_282834_C1.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block RND 205-00067, 2 pins, http://cdn-reichelt.de/documents/datenblatt/A500/DLC2-6GD%28V6%29.pdf LED diameter 10.0mm 2 pins diameter 3.0mm z-position of LED center 9.0mm 2 pins Rectangular size 4.0x2.8mm^2 diameter 2.0mm THT pad as test Point, diameter 4.0mm 2 pins LED diameter 1.8mm size 1.8x2.4mm^2 z-position of LED center 1.0mm, 2 pins Rectangular size 5.0x2.0mm^2 z-position of LED center 1.0mm, 2 pins Ceramic Resomator/Filter 6.0x3.0mm^2, length*width=6.0x3.0mm^2 package, package length=8.0mm, package width=3.5mm, 3 pins THT ceramic resonator filter DSN6 Ceramic Resomator/Filter Murata TPSKA, http://cdn-reichelt.de/documents/datenblatt/B400/SFECV-107.pdf, 7.9x3.8mm^2 package Diode MicroSMP (DO-219AD), large-pad.
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