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Sensirion DFN-8 SHT3x-DIS (https://www.sensirion.com/fileadmin/user_upload/customers/sensirion/Dokumente/2_Humidity_Sensors/Datasheets/Sensirion_Humidity_Sensors_SHT3x_Datasheet_digital.pdf 24-Lead Plastic Shrink Small Outline (SO), see http://datasheet.octopart.com/OPIA403BTRE-Optek-datasheet-5328560.pdf 4-Lead Plastic Stretched Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN 4-Lead Plastic Small Outline (ST)-4.4 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf TQFP, 100 Pin (JEDEC MO-241/VAB, https://assets.nexperia.com/documents/package-information/SOT763-1.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py Infineon PG-DSO 12 pin, exposed pad: 4.5x8.1mm, with thermal vias; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l476me.pdf WLCSP-81, 9x9 raster, 4.4084x3.7594mm package, pitch 0.65mm VFBGA-86.

4.54413 -5.74517 7.2866 facet normal -0.243766.
4.61842 -4.98874 7.03804 facet normal.
That well. MSLA (resin) printing.

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