Labels Milestones
BackBGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=277, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=296, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=91, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole straight pin header, 1x22, 2.00mm pitch, single row Through hole angled pin header, 1x24, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 1x20 2.54mm single row style1 pin1 left Surface mounted socket strip THT 2x48 1.27mm double row surface-mounted straight socket strip, 2x39, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole angled pin header, 2x39, 2.00mm pitch, 6.35mm socket length.
- Size 115x10.3mm^2, drill diamater 1.5mm.
- Right_panel_width = 12; // overkill; currently three 3.5mm.