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Back3-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_8_05-08-1637.pdf Texas Instrument DRT-3 1x0.8mm Pitch 0.7mm Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA.
- 8.30568 3.44384 3 vertex.
- -0.507857 0.708689 vertex -5.62839 4.67928 7.09583 vertex.
- Length*width=6.0x3.0mm^2 package, package length=7.0mm, package width=2.5mm.