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Transducer (https://www.lem.com/sites/default/files/products_datasheets/la_25-p.pdf LEM current transducer (https://www.lem.com/sites/default/files/products_datasheets/hx%203_50-p_sp2_e%20v07.pdf LEM HX50-P-SP2 hall effect current transducer (https://www.lem.com/sites/default/files/products_datasheets/hx%203_50-p_sp2_e%20v07.pdf LEM HX15-NP hall effect current transducer LEM_LTSR-NP 5V supply voltage series https://www.lem.com/sites/default/files/products_datasheets/ltsr_6-np.pdf DFN, 4 Pin (http://www.ixysic.com/home/pdfs.nsf/www/CPC1017N.pdf/$file/CPC1017N.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: AE-6410-03A example for new part number: 5273-10A example for new mpn: 39-29-4049, 2 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf), generated with kicad-footprint-generator Inductor SMD 1008 (2520 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 46 Pin (http://www.ti.com/lit/ds/symlink/lp5036.pdf#page=59), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 56 Pin (https://datasheets.raspberrypi.com/rp2040/rp2040-datasheet.pdf#page=634), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 2.5 mm² wire, reinforced insulation, conductor diameter 1.4mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py SSOP24: plastic shrink small outline package; 44 leads; body width 4.4 mm; thermal pad HTSSOP32: plastic thin shrink small outline package; 28 leads; body width 4.4 mm (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 temperature sensor diode TO-92 horizontal, leads in-line, narrow, oval pads, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline package; 44 leads; body width 7.5 mm; (see NXP sot054_po.pdf TO-92 leads molded, narrow, drill 0.75mm (http://www.produktinfo.conrad.com/datenblaetter/175000-199999/181293-da-01-de-TO92_Temperatursensor_PT1000_32209225.pdf Molded Japan Transistor Package 7x4x9mm^3, http://rtellason.com/transdata/2sb734.pdf Non Isolated Modified TO-220 7pin Package, see http://www.farnell.com/datasheets/5793.pdf Power Integration Y Package SIPAK, Horizontal, RM 1.27mm, staggered type-1, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Vertical RM 5.45mm TO-247-4, Horizontal, RM 2.54mm TO-247-5, Horizontal, RM 2.54mm, staggered type-2 TO-220-9 Horizontal RM 1.7mm staggered type-1 TO-220F-2, Horizontal, RM 1.7mm, Pentawatt, Multiwatt-5, staggered type-1, see http://www.ti.com/lit/ds/symlink/lmd18200.pdf TO-220-15, Vertical, RM 1.7mm, Pentawatt, Multiwatt-5, see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-to-220/to-220_5_05-08-1421_straight_lead.pdf TO-220-5 Horizontal RM 5.475mm.

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