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Grid, YZT, 1.86x1.36mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00869D.pdf#page=1 MAPBGA 14x14x1.18 PKG, 14.0x14.0mm, 289 Ball, 17x17 Layout, 0.8mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081600_0_bga49.pdf https://www.analog.com/media/en/technical-documentation/product-information/assembly-considerations-for-umodule-bga-lga-package.pdf BGA 324 0.8 CSGA324 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition Appendix A Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row Surface mounted socket strip SMD 1x29 2.54mm single row Through hole angled pin header THT 2x39 1.00mm double row Through hole angled pin header, 2x29, 1.27mm pitch, double rows Through hole angled pin header, 2x25, 2.54mm pitch, 6mm pin length, double rows Surface mounted pin header SMD 1x10 1.00mm single row style2 pin1 right Through hole IDC box header 2x04 2.54mm double row Through hole angled socket strip, 2x06, 1.27mm pitch, double rows Surface mounted pin header THT 1x02 1.27mm single row style2 pin1 right Through hole pin header SMD 2x36 2.54mm double row Through hole socket strip THT 2x06 1.27mm double row Through hole angled pin header, 1x35, 1.00mm pitch, single row Surface mounted pin header THT 2x28 2.00mm double row Through hole angled pin header, 2x07, 2.54mm pitch, 6mm pin length, single row (from Kicad 4.0.7), script generated Through hole.

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