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MINIMOLD package, see https://www.vishay.com/docs/82669/tsop32s40f.pdf IR Receiver Vishay TSOP-xxxx, MOLD package, see https://www.vishay.com/docs/82742/tsop331.pdf IR Receiver Vishay TSOP-xxxx, MINICAST package, see https://www.vishay.com/docs/82742/tsop331.pdf IR Receiver Vishay TSOP-xxxx, MOLD package, see https://www.vishay.com/docs/82742/tsop331.pdf IR Receiver Vishay TSOP-xxxx, MINICAST package, see https://www.vishay.com/docs/82742/tsop331.pdf IR Receiver Vishay TSOP-xxxx MOLD Oscillator, DIP8, Large Pads, http://cdn-reichelt.de/documents/datenblatt/B400/OSZI.pdf Oscillator, DIP14, Large Pads, http://cdn-reichelt.de/documents/datenblatt/B400/OSZI.pdf Miniature Crystal Clock Oscillator EuroQuartz XO91 series, http://cdn-reichelt.de/documents/datenblatt/B400/XO91.pdf, hand-soldering, 7.0x5.0mm^2 package SMD Crystal EuroQuartz EQ161 series http://cdn-reichelt.de/documents/datenblatt/B400/PG32768C.pdf, hand-soldering, 3.2x1.5mm^2 package SMD SMT crystal hand-soldering SMD Resomator/Filter Murata TPSKA, http://cdn-reichelt.de/documents/datenblatt/B400/SFECV-107.pdf, hand-soldering, 4.5x2.0mm^2 package SMD Crystal Oscillator Seiko Epson MC-406 https://support.epson.biz/td/api/doc_check.php?dl=brief_MC-306_en.pdf, hand-soldering, 9.6x4.1mm^2 package SMD Crystal MicroCrystal CC4V-T1A series http://cdn-reichelt.de/documents/datenblatt/B400/CC4V-T1A.pdf, hand-soldering, 5.0x1.9mm^2 package SMD Crystal EuroQuartz MT series http://cdn-reichelt.de/documents/datenblatt/B400/MT.pdf, 3.2x2.5mm^2 package crystal Epson Toyocom TSX-3225 series https://support.epson.biz/td/api/doc_check.php?dl=brief_fa-238v_en.pdf, hand-soldering, 3.2x2.5mm^2 package SMD Crystal Seiko Epson SG-8002JC https://support.epson.biz/td/api/doc_check.php?mode=dl⟨=en&Parts=SG-8002DC, hand-soldering, 14.0x8.7mm^2 package SMD Crystal Seiko Epson MC-156 https://support.epson.biz/td/api/doc_check.php?dl=brief_MC-156_en.pdf, 7.1x2.5mm^2 package SMD Crystal TXC 7M http://www.txccrystal.com/images/pdf/7m-accuracy.pdf, hand-soldering, 3.2x2.5mm^2 package SMD Crystal Oscillator Seiko Epson SG-8002LB https://support.epson.biz/td/api/doc_check.php?mode=dl⟨=en&Parts=SG-8002DC, 5.0x3.2mm^2 package 14-lead dip package, row spacing 11.48 mm (451 mils 12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 6-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 16-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 24.13mm 950mil SMDSocket LongPads 42-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils Analog BGA-28 4.0mm x 6.25mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, NSMD, YZP0005 pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1963-1.pdf ST LFBGA-354, 16.0x16.0mm, 354 Ball, 19x19 Layout, 0.8mm.

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