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DF52-6S-0.8H (https://www.hirose.com/product/en/products/DF52/DF52-3S-0.8H%2821%29/), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1410, with PCB cutout, light-direction downwards, see http://www.everlight.com/file/ProductFile/ITR8307.pdf refective opto couple photo coupler package for diode bridges, row spacing 10.16 mm (400 mils 10-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 2x-dip-switch SPST Copal_CHS-02A, Slide, row spacing 7.62 mm (300 mils), body size 6.7x29.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 8x-dip-switch SPST Copal_CHS-08B, Slide, row spacing 25.4 mm (1000 mils), Socket 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x9.18mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 8x-dip-switch SPST Copal_CHS-08A, Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 12-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, SmallPads 18-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 16-lead though-hole mounted high-volatge DIP package (based on.

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