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TR-x2D(C)(T) modules, http://iqrf.org/weben/downloads.php?id=104 8 pin SIM connector for 1.6mm PCB's with 70 contacts (not polarized Highspeed card edge connector for PCB's with 70 contacts (not polarized Highspeed card edge connector for 2.4mm PCB's with 40 contacts (not polarized Highspeed card edge connector for 2.4mm PCB's with 20 contacts (not polarized Highspeed card edge connector for PCB's with 60 contacts (polarized Highspeed card edge connector for 2.4mm PCB's with 40 contacts (not polarized Highspeed card edge connector for 2.4mm PCB's with 60 contacts (not polarized Highspeed card edge connector for 1.6mm PCB's with 08 contacts (not polarized Highspeed card edge card connector socket for 1.57mm PCBs, vertical (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm BGA-64, 10x10 raster, 9x9mm package, pitch 0.65mm; see section 6.1 of http://www.st.com/resource/en/datasheet/stm32f405og.pdf WLCSP-100, 10x10 raster, 9x9mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f103tb.pdf LFBGA-144, 12x12 raster, 7x7mm package, pitch 0.65mm VFBGA-86, 6.0x6.0mm, 86 Ball, 10x10 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition Appendix A BGA 1156 1 FF1157 FFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition Appendix A BGA 196 0.5 CPGA196 Artix-7 BGA, 18x18 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition Appendix A BGA 1156 1 RF1157 RF1158 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole IDC header, 2x30, 2.54mm pitch, 6mm pin length, single row Surface mounted socket strip SMD 2x22 1.27mm double row Through hole pin header SMD 2x04 1.00mm double row surface-mounted straight pin header, 2x05, 2.00mm pitch, 6.35mm socket length, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x28, 1.27mm pitch, double rows Through hole IDC header, 2x08, 2.00mm pitch, single row (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x25 2.54mm single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x24 2.00mm double row Through hole pin header THT 2x30 2.54mm double row Through hole socket strip SMD 1x31 1.00mm single row Surface mounted socket strip SMD 1x12 1.27mm single row Through hole angled socket strip THT 2x24 2.54mm double row Through hole angled socket strip THT 1x11 1.27mm single row (from Kicad 4.0.7), script generated Through hole angled pin header SMD 1x19 2.00mm single row Surface mounted socket strip SMD 2x22 1.00mm double row Through hole angled socket strip, 2x10, 2.54mm pitch, single row style1 pin1 left.

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