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Height=9.5mm tact sw push PVA1 DPST momentary / push-push button, h=17.5mm C&K PVA1 https://www.ckswitches.com/media/1343/pva.pdf momentary / push-push button, h=20.5mm C&K PVA1 https://www.ckswitches.com/media/1343/pva.pdf momentary / push-push button, h=23mm C&K PVA2 https://www.ckswitches.com/media/1343/pva.pdf tact sw push PVA2 DPDT momentary / push-push button, h=15mm C&K PVA1 https://www.ckswitches.com/media/1343/pva.pdf momentary / push-push button, h=20.5mm C&K PVA1 https://www.ckswitches.com/media/1343/pva.pdf tact sw push 6mm tactile push button, 6x6mm e.g. PHAP33xx series, height=8mm tactile push button, 6x6mm e.g. PHAP33xx series, height=9.5mm tactile push button, 6x6mm e.g. PHAP33xx series, height=13mm FS5700 series pushbutton footswitch, DPDT, https://www.e-switch.com/system/asset/product_line/data_sheet/226/FS5700.pdf Switch with High Contact Reliability, Top-actuated Model, without Ground Terminal, without Boss Ultra-small-sized Tactile Switch SPST Slide 7.62mm 300mil 3-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 22-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size 9.78x12.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 8x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x19.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 1x-dip-switch SPST Copal_CHS-01B, Slide, row spacing 7.62 mm (300 mils Analog BGA-28 4.0mm x 6.25mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l031f6.pdf WLCSP-25, 5x5 raster, 2.133x2.070mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition Appendix A BGA 1924 1 FF1926 FFG1926 FF1927 FFG1927 FFV1927 FF1928 FFG1928 FF1930 FFG1930 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 1156 1 RF1157 RF1158 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition Appendix A Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition Appendix A BGA 676 1 FF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 34x34.

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