Labels Milestones
Back505AB (see ON Semiconductor 932BB.PDF 144-Lead Plastic Thin Quad Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations variant of 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 3x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil SMDSocket SmallPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL ZIF 25.4mm 1000mil Socket 40-lead though-hole mounted DIP package, row spacing 24.13 mm (950 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing.
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- 1-826576-8, 18 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf.