Labels Milestones
Back(264 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD DIP DIL ZIF 15.24mm 600mil SMDSocket SmallPads 64-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD DIP DIL PDIP 2.54mm 7.62mm 300mil 8-lead dip package, row spacing 25.4 mm (1000 mils), LongPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket 3M 16-pin zero insertion force socket, through-hole, row spacing 11.48 mm (451 mils 10-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 64-lead though-hole.
- Connector, FF0829SA1, 29 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ108178.pdf.
- Quectel L80-R GPS Module, Linx.