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39-28-x20x, 10 Pins per row (http://www.molex.com/pdm_docs/sd/431605304_sd.pdf), generated with kicad-footprint-generator Net tie, 4 pin, 0.5mm square SMD pads Net tie, 3 pin, 1.0mm round THT pads Net tie, 3 pin, 0.3mm round THT pads Net tie, 4 pin, 1.0mm round THT pads Net tie, 3 pin, 2.0mm square SMD pads Net tie, 4 pin, 0.5mm square SMD pads Net tie, 3 pin, 0.5mm square SMD pads Net tie, 4 pin, 0.3mm round THT pads Laser Gaming Sensor ADNS-9800 Fiberoptic Transmitter TX, HFBR series (https://docs.broadcom.com/docs/AV02-3283EN Fiberoptic Receiver RX, HFBR series (https://docs.broadcom.com/docs/AV02-3283EN Fiberoptic Receiver RX, HFBR series (https://docs.broadcom.com/docs/AV02-3283EN TSL2550 ambient light sensor chipled Broadcom DFN, 6 Pin (https://www.ti.com/lit/ds/symlink/sn74auc1g04.pdf#page=24), Solder Mask Defined VSON, 8 Pin (http://www.ti.com/lit/ds/symlink/lp2951.pdf#page=27), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, 105310-xx06, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-103-02-xxx-DV-LC, 3 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Molex Nano-Fit top entry Molex SPOX Connector System, 53047-1010, 10 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog&lang=en&documentid=D31688_en), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-112-02-xxx-DV-LC, 12 Pins per row (https://www.molex.com/pdm_docs/sd/430450201_sd.pdf), generated with kicad-footprint-generator Molex Panelmate series connector, B8P-VH-B (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for a single 0.127 mm² wire, basic insulation, conductor diameter 1.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 9, Wuerth electronics 9775051960 (https://katalog.we-online.com/em/datasheet/9775051960.pdf), generated with kicad-footprint-generator JST XA series connector, B3P-VH-B (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator JST XA series connector, DF3EA-08P-2H (https://www.hirose.com/product/document?clcode=CL0543-0332-0-51&productname=DF3EA-5P-2H(51)&series=DF3&documenttype=2DDrawing&lang=en&documentid=0001163317), generated with kicad-footprint-generator ipc_noLead_generator.py Texas instruments QFN Package, datasheet: https://www.ti.com/lit/ds/symlink/tpsm53602.pdf Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (perimeter) array, NSMD pad definition Appendix A BGA 484 1 FG484 FGG484 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=277, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=296, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=91, NSMD pad definition Appendix A BGA 1924 1 FF1926 FFG1926 FF1927 FFG1927 FFV1927 FF1928 FFG1928 FF1930 FFG1930 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition Appendix A BGA 1924 1 FF1926 FFG1926 FF1927 FFG1927 FFV1927 FF1928 FFG1928 FF1930 FFG1930 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=304, NSMD pad definition.

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