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Ublox NEO 6/7/8, (https://www.u-blox.com/sites/default/files/NEO-8Q-NEO-M8-FW3_HardwareIntegrationManual_%28UBX-15029985%29_0.pdf GPS ublox MAX 6/7/8 ublox MAX 6/7/8 ublox NEO 6/7/8 GPS Module, Linx (https://linxtechnologies.com/wp/wp-content/uploads/rxm-gps-rm.pdf Quectel L80-R GPS Module, 15.5x15.5x6.3mm, https://www.u-blox.com/sites/default/files/SAM-M8Q_HardwareIntegrationManual_%28UBX-16018358%29.pdf GPS GNSS ublox ZED GSM NB-IoT Module BC66 M66 GSM NB-IoT module, 19.9x23.6x2.2mm, https://www.quectel.com/UploadImage/Downlad/Quectel_BC95_Hardware_Design_V1.3.pdf GSM NB-IoT module, 15.8x17.7x2mm, https://www.quectel.com/UploadImage/Downlad/Quectel_BC66_Hardware_Design_V1.1.pdf GSM NB-IoT module BC95 Quad-Band GSM/GPRS module, 17.6x15.7x2.3mm, http://simcom.ee/documents/SIM800C/SIM800C_Hardware_Design_V1.05.pdf Quad-Band GSM/GPRS module, 24x24x3mm, http://simcom.ee/documents/SIM900/SIM900_Hardware%20Design_V2.05.pdf Telit xL865 familly footprint, http://www.telit.com/fileadmin/user_upload/products/Downloads/3G/Telit_UL865_Hardware_User_Guide_r8.pdf ublox Sara GSM/HSPA modem, https://www.u-blox.com/sites/default/files/SARA-G3-U2_SysIntegrManual_%28UBX-13000995%29.pdf, pag.162 ublox SARA-G3 SARA-U2 GSM HSPA Footprint for Mini-Circuits case QQQ130 (https://ww2.minicircuits.com/case_style/QQQ130.pdf) following land pattern PL-176, including GND vias (https://ww2.minicircuits.com/pcb/98-pl230.pdf Footprint for Mini-Circuits case GP731 (https://ww2.minicircuits.com/case_style/GP731.pdf Footprint for the principle https://www.lookmumnocomputer.com/simplest-oscillator/ for a single 2 mm² wires, reinforced insulation, conductor diameter 2mm, see http://www.produktinfo.conrad.com/datenblaetter/550000-574999/556444-da-01-de-LEITERPLATTENKL__PTSM_0_5__4_2_5_V_THR.pdf, script-generated with , script-generated with , script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block Phoenix MKDS-1,5-4-5.08, 4 pins, pitch 5mm, size 12.3x14mm^2, drill diamater 1.2mm, pad diameter 2.7mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad; (http://www.ti.com/lit/ds/symlink/drv8833.pdf HTSSOP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_21.pdf), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 5267-12A, 12 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0694-9-81&productname=DF12C(3.0)-50DS-0.5V(81)&series=DF12&documenttype=2DDrawing⟨=en&documentid=0000994748), generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for: MC_1,5/10-GF-3.5; number of pins: 03; pin pitch: 3.81mm; Angled; threaded flange || order number: 1924512 16A (HC Generic Phoenix Contact connector footprint for: MC_1,5/6-G-3.5; number of pins: 02; pin pitch: 5.00mm; Angled; threaded flange || order number: 1924318 16A (HC Generic Phoenix Contact connector footprint for: GMSTBVA_2,5/5-G.

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